Product Brochure/Datasheet
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Each of several items in a list, preceded by a bullet symbol for emphasis.
:
- - Suitable for CPU, chipsets on Mainboard, VGA card, etc
- - Easy to use
- - Zif Socket Templates ensure correct applying area with various CPU socket types
- - Produces an even layer when using applicator
- - Dielectric
- - Wide range of application temperature
Long product name Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
:
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
The short editorial description of Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
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Short summary description Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K:
This short summary of the Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K data-sheet is auto-generated and uses the product title and the first six key specs.
Cooler Master HTK-002, Thermal paste, 4.5 W/m·K, White, 0.8 °C/W, 2.37 g/cm³, 1 pc(s)
Long summary description Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K:
This is an auto-generated long summary of Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K based on the first three specs of the first five spec groups.
Cooler Master HTK-002. Type: Thermal paste, Thermal conductivity: 4.5 W/m·K, Product colour: White. Quantity per pack: 1 pc(s), Package width: 102 mm, Package depth: 171 mm